Create highly integrated products with a smaller package 和 increased functionality
Semiconductor industry dem和s for higher levels of integration 和 lower costs coupled with a growing awareness of complete system configuration have continued to drive the popularity of System in Package (SiP) solutions. 冰球突破试玩’s SiP technology is an ideal solution in markets that dem和 a smaller size with increased functionality. 通过装配, testing 和 shipping millions of SiP devices per day, 冰球突破试玩 技术 has a proven track record as the industry leader in SiP design, assembly 和 test.
冰球突破试玩’s Center of Excellence for substrate-based SiP technology is located in our largest volume manufacturing facility in ATK4 Kwangju, 韩国. The large-scale manufacturing capabilities in ATK4 factory can achieve significant volume production support with very high yields with short cycle times.
冰球突破试玩 技术 defines advanced SiPs as multi-component, multifunction products in an IC package. They require high-precision assembly technologies, which leverage 冰球突破试玩’s strengths.
System in Package technology allows multiple advanced packaging technologies to be combined to create solutions customized to each end application. 层压板 based SiP technology is in a front-runner solution 和 most popular SiP solution for cellular, 物联网, 权力, 汽车, networking 和 computing system integrations.
Existing market uses for SiP include:
- RF 和 wireless devices
Power amplifiers, front-end module, 天线开关, GPS/GNSS modules, cellular h和set, 和 cellular infrastructure, 蓝牙® solutions, 5G NR Antenna in Package (AiP)
- 物联网 for wearable 和 Machine to Machine (M2M)
连接, 微机电系统, microcontroller, memory, antenna, PMIC 和 other mixed-mode devices
- 汽车 applications
Infotainment 和 sensory modules
DC/DC converter, LDO, PMIC, battery management 和 others
- Logic, analog 和 mixed-mode technology
Tablets, PCs, display 和 audio
- 计算 和 networking
5G networking 和 modems, data center, storage 和 SSD
- Extension of the technology platform to a wider field of application areas is ongoing
Antenna in Package (AiP)/Antenna on Package (AoP)
(5G NR) SiP Solutions
Millimeter wave (mmWave) radio design with beamforming 和 array antenna will be used in varieties of advanced SiP products for 5G cellular systems. Millimeter electromagnetic wave design is imposing a new challenge for the system designers, components 和 SiP packaging engineers.
Key 冰球突破试玩 包装 Technologies for 航/ AoP
- Greater than 26 GHz achieved
- Compartmental shielding
- Partial (selective) conformal shielding
- Partial molding
- Body size: up to 23.0毫米x 6.0 mm
- Substrate layer counts: up to 14 layers
- Low loss 和 low dielectric substrate
Double Sided Molded Ball Grid Array (DSMBGA)
To further improve the integration 和 robustness of RFFE solutions, 冰球突破试玩 has developed a Double Sided Molded Ball Grid Array (DSMBGA) package to allow molded assembly of components on both sides of the substrate.
Key 冰球突破试玩 包装 Technologies for DSMBGA
- Increased integration for RFFE modules with significantly reduced package height
- Allows integration of antenna tuners 和 passive components
- Improves signal integrity 和 reduces losses
- Conformal 和 compartmental shielding for EMI isolation
- In-line RF testing
Contact an 冰球突破试玩 expert by clicking the request info button below.