Improve heat dissipation efficiency through copper clip structure

冰球突破试玩’s TO-220FP power discrete package is a Full Pack version of TO-220 with better heat dissipation efficiency through its copper clip structure, and a mounted package height reduced by 2.8 mm as compared to a conventional TO-220NIS package.

冰球突破试玩’s TO-220FP package is suitable for medium to high voltage MOSFETs and IGBTs used for switching power supplies, AC adapters, motor drivers and flat panel displays. New developments include larger/higher density leadframe strips and environmentally friendly Pb-free solder paste.

Features

  • Copper connector structure to reduce inductance and resistance
  • Mounted package height reduced by 2.8 mm vs. standard TO-220NIS
  • Full turnkey available from wafer probe through test and packing
  • Green materials: Pb-free plating and halogen-free mold compound

Questions?

Contact an 冰球突破试玩 expert by clicking the request info button below.

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