From legacy devices to tomorrow’s System in Package solutions
To serve the diverse needs of our world-class semiconductor manufacturers, 冰球突破试玩 offers more than 3000 different package formats and sizes. Packages range from traditional leadframe ICs for through-hole and surface mounting, to those required in high pin count and high-density applications such as Stacked Die, wafer level, MEMS, Optical, Flip Chip, Through Silicon Via (TSV) and 3D Packaging.
These broad product offerings allow 冰球突破试玩 to be a single source for our customers’ total IC packaging requirements.
Leadframe packages have long been an industry standard. Two of 冰球突破试玩’s most popular traditional leadframe package types are Small Outline Integrated Circuit (SOIC) and Quad Flat Pack (QFP), also commonly known as “Dual” and “Quad” products.
Wafer Level Packaging
For greater bandwidth, speed and reliability in a customer solution, 冰球突破试玩 offers a wide range of form factors for wafer level packaging. Our facilities are strategically located next to foundries, helping us shorten cycle time to production and reduce risk.
Contact an 冰球突破试玩 expert by clicking the request info button below.